T2C FDT - debonding tape
Adhesive tape with a polyester carrier and a layer of strong adhesive that guarantees instant adhesive strength. This tape has a plastic sleeve and vacuum packaging, which makes it suitable for use in areas with high requirements for cleanliness and dust-free.
This material is used for the removal / peeling off of protective and covering films of electronic components, for example, removing the covering film of wafers during chip production, peeling off the covering film of display components, peeling off the covering film of optical lenses and others.
This tape is also used for splicing rolls of flexible materials.
The tape is available in a variety of rolls from 200 m to 1,000 m, enabling maximum productivity of the peeling equipment.
The Hanak Trade company offers further processing of this material, such as rolls of non-standard size, shaped cutouts or lamination for various materials. You can find more information about the services offered on the SERVICES subpage.